GE reliability testing
As already stated, there are several key contributors to outdoor LED system reliability.
Each of these contributing factors is scrutinized both individually and together at the
system level to ensure the acceptability of overall system performance and reliability.
Examples of this approach are highlighted in the next several paragraphs.
Electronic drivers
Electronic driver reliability begins with a series of predictive models using tools such as
those in Reliacore’s Relex Reliability Studio or Reliasoft’s
®
Lambda Predict
®
. These models
function as design tools used for predicting failure rates based on reliability prediction
standards such as Bellcore/Telcordia and MIL-HDBK-217F as two examples. Engineers
use these tools to make initial reliability estimates of a design, identify potential weak
points, and evaluate the system impact when components or application conditions
are changed. During the design phase, engineers evaluate tradeos and compare
model results to the specied project requirements to select the optimal design for
fabrication and testing.
Drivers are required to pass a variety of well-dened testing requirements before entering
service in GE LED systems. In addition to standard reliability life testing, accelerated test
methods, robustness testing, surge immunity and EMI testing are employed.
ALT (Accelerated Life Test) utilizes elevated stress conditions to more quickly estimate
performance and life at lower nominal conditions by tting the output data to a
statistical model. Common acceleration factors include temperature, humidity and
power cycle testing.
HALT (Highly Accelerated Life Testing) includes a series of progressive steps with
wide-ranging temperatures, rapid thermal cycling, multi-axis vibration testing, power
cycling and other product-specic conditions. This testing is used to determine the
operation and destruct limits of the product.
STRIFE, or Stress Plus Life testing, is also used early in the development cycle to draw
out potential design or manufacturing weaknesses. During testing, units are put
through high- and low-temperature cycles over a period of time dened by the
industry standard model for fatigue-induced solder joint failures (known as the
Norris-Landzberg equation).
STRIFE, or Stress Plus Life testing, is also used early
in the development cycle to draw out potential
design or manufacturing weaknesses.
(2 Seiten)
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